LPKF ProtoLaser S4
Laser Structuring of Prototype PCBs and Small Series
Descripción
New Design
The LPKF ProtoLaser S4 features the new LPKF design, combining a classy look with clever solutions for operation and maintenance. Integration of the control PC is optional.
Cost-Effectiveness Built In
The ProtoLaser S4 is a valuable tool in the electronics lab. It can quickly and accurately generate fine structures and uses a special procedure for ablating large areas. The laser process requires no masks or tools to produce one-offs or individual marks.
Expanded Process Window
Switching to a green laser wavelength increases the range of applications. A green laser is much less likely to burn the substrate. It can also reliably machine inhomogeneous metal layers up to 6 μm in thickness – e. g., boards with fully metallized surfaces following galvanic via plating. The ProtoLaser S4 can cut rigid or flexible substrates efficiently with thicknesses of up to 0.8 mm.
Vision System
The LPKF ProtoLaser S4 has a newly designed camera and image processing system that has been optimized for circuit board prototyping. A higher resolution and faster detection algorithms accelerate the manufacturing process.
The LPKF ProtoLaser S laser system structures complete PCBs in minutes. The huge time savings mean that different layouts can be tested quickly and simply. Prototypes and small production batches can also be produced on short notice if required. The system requires no chemicals and is easy to operate.
The LPKF ProtoLaser S is even more precise than the mechanical systems and is therefore ideal for HF and microwave circuits, as well as digital and analog circuits. It produces precise geometries on a whole range of substrates such as copper-clad FR4, aluminum-coated PET films, ceramics, Duroid and PTFE.
Alignment for two-sided prototypes increases tremendously with the fiducial recognition camera. This camera allows the LPKF ProtoLaser S to visually inspect and properly align the workpiece.
For drilling through-holes in printed circuit boards, an LPKF ProtoMat is a perfect complement to a LPKF ProtoLaser S4.
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Specialist in circuit board processing
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Laser wavelength of 532 nm (green)
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Process reliability
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Up-to-date design
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CircuitPro system software
Datos Técnicos
LPKF ProtoLaser S4
Max. material size and layout area
(X x Y x Z)
Laser wavelength
Structuring speed
Laser pulse frequency
Minimum line / space
Laser spot diameter in focus position
Accuracy**
Dimensions (W x H x D)
Weight
Electrical consumption
Required compressed air supply
Required accessories
229 mm x 305 mm x 10 mm
(9” x 12” x 0.4”)
532 nm
650 mm/s (25”/s) on 18 μm / ½ oz Cu on FR4
25 kHz – 300 kHz
75 μm / 25 μm (2.9 mil / 1 mil),
on laminated substrate (18 μm Cu)
23 μm (0.9 mil)
± 1.98 μm (± 0.08 mil)
910 mm x 1 650 mm x 795 mm (35.8” x 65” x 31.3”);
height with open door 1 765 mm (69.5”)
340 kg
Min. 6 bar (87 psi), min. 230 l/min (8.12 cfm)
110 V – 230 V; 1.4 kW
Exhaust unit, compressor, PC
Brochure LPKF ProtoLaser S4
Download PDF
Cirentec S.A. de C.V
Hidalgo No 6,
Colonia Santa Maria Tonantzintla
San Andres Cholula, Puebla, 72840
Telefono:
(222)2613009
Correo:
ventas@cirentec.com.mx
alfredomtz@cirentec.com.mx